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an26032a 1 ver. ceb z dtv uhf simplified application applications features description ultra small , single band lna-ic with band-limiting filter for 600 mhz band applications an26032a is single band lna-ic for 600 mhz band applications. it realizes high performance by using 0.18 m sigec bi-cmos process (f t = 90 ghz, f max = 140 ghz). high/low gain mode is changeable, controlled by integrated cmos logic circuit. the band limiting f ilter is built-in. a wlcsp package (wafer level chip sized package) achieves miniaturization. notes) this application circuit is an example. the operation of mass production set is not guaranteed. you should perform enough evaluation and verification on the design of mass production set. you are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. murata LQP03TN12NJ04 12 nh 0603 l2 murata grm33b30j104ke18 100 000 pf 0603 c2 vendor part number value size components murata grm033b11c102kd01 1 000 pf 0603 c1 murata lqp03tn8n2h04 8.2 nh 0603 l1 ? low voltage operation +2.85 v typ. ? low current consumption 4 ma typ. (high-gain mode) 1 a typ. (low-gain mode) ? high gain 14.0 db typ. frx = 620 mhz (high-gain mode) ? low noise figure 1.20 db typ. frx = 620 mhz (high-gain mode) ? low distortion (iip3 +10 mhz offset) 4 dbm typ. frx = 620 mhz (high-gain mode) ? small and thin package 6 pin wa fer level chip size package (wlcsp) 50 rf input 50 rf output a3 l1 c1 v cc c2 cnt (gain cnt) b3 l2 a2 a1 top view b1 b2 publication date: february 2013
an26032a 2 ver. ceb absolute maximum ratings *4 v -0.3 to (v cc + 0.3) cnt (pin no.b1) ? v ?0.3to1.4 out1 (pin no.a3) ? v ?0.3to1.4 out2 (pin no.b3) ? ma 18 i cc supply current *2 c -40to+125 t j operating junction temperature *3 v ? in (pin no.a1) input voltage range *2 c ?55 to +125 t stg storage temperature ? kv 1 hbm (human body model) esd notes unit rating symbol parameter *2 c ?25 to+85 t opr operating ambient temperature *1 v 3.6 v cc supply voltage notes). this product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rati ng. this rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated recommended operating range. when subjected under the absolute maximum rating for a long time, the reliability of the product may be affected. *1:the.values under the condition not exceeding the above absolute maximum ratings and the power dissipation *2:except for the operating ambient temperature, operating junction temperature, and storage temperature, all ratings are for ta = 25 c. *3:rf signal input pin. do not apply dc. *4:(vcc + 0.3) v must not be exceeded 3.6v. 0.028w 0.070w 1433 /w wlcsp pd (ta=85 c) pd (ta=25 c) ja package power dissipation rating note). for the actual usage, please refer to the pd-ta c haracteristics diagram in the package specification, supply voltage, load and ambient te mperature conditions to ensure that t here is enough margin follow the power and the thermal design does not exceed the allowable value. caution although this has limited built-in esd protecti on circuit, but permanent damage may occur on it. therefore, proper esd precautions are recommended to avoid electrostatic damage to the mos gates recommended operating conditions 2.85 typ. 2.5 min. *1 v 3.0 v cc supply voltage range notes unit max. symbol parameter note) *1 : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
an26032a 3 ver. ceb ? v 0.55 0.0 ? ? vil switching voltage (low-gain mode) ? a 9.5 4 ? current at cnt pin vih = vcc iih switching current (high) ? v ? 2.85 1.40 ? vih switching voltage (high-gain mode) ? a 9.5 1.0 ? vcc current at low-gain mode no input signal iccl supply current lg dc electrical characteristics ? ma 5.8 4.0 ? vcc current at high-gain mode no input signal icch supply current hg limits typ unit max note min condition symbol parameter elecrtrical characteristics note) vcc = 2.85v t a = 25 c 2 c unless otherwise specified ac electrical characteristics ? db 16 14 12 high-gain mode f = frx ghs power gain hg ? db ?1.5 ?4.5 ?7 low-gain mode f = frx, prx = ?20 dbm gls power gain lg ? dbm ? 4 ?4 high-gain mode f1 = frx + 10 mhz f2 = frx + 20 mhz input 2 signals (f1, f2) iip3h1s iip3?10 mhz offset hg limits typ unit max note min condition symbol parameter elecrtrical characteristics (continued) note) vcc = 2.85 v ta = 25 c 2 c, frx = 620 mhz, prx = ?30 dbm, cw unless otherwise specified.
an26032a 4 ver. ceb notes) vcc = 2.85 v ta = 25 c 2 c, frx = 470 mhz, 620 mhz, 770 mhz, prx = ?30 dbm, cw unless otherwise specified. *1 db ? ?4.5 ? high-gain mode f = frx isol reverse isolation lg *1 db ? ?27 ? high-gain mode f = frx isoh reverse isolation hg *1 db ?24 ?31 ? high-gain mode f1 = 620 mhz f2 = 1520 mhz gain(f2) ? gain(f1) atth1 attenuation1 hg *1 dbm ? ?10 ?14 high-gain mode f = frx ip1dbh input p1db hg *1 db ?41 ?49 ? high-gain mode f1 = 620 mhz f2 = 1880 mhz gain(f2) ? gain(f1) atth2 attenuation2 hg high-gain mode f1 = frx ? 10 mhz f2 = frx ? 20 mhz input 2 signals (f1, f2) low-gain mode f = frx low-gain mode f = frx, prx = ?20 dbm *1 ,*2 db 1.7 1.3 ? high-gain mode f = frx nfh noise figure hg *1,*2 db 7.5 4.5 ? nfl noise figure lg *1 dbm ? 4 ?5 high-gain mode f1 = frx + 10 mhz f2 = frx + 20 mhz input 2 signals (f1, f2) iip3h1 iip3 +10 mhz offset hg ac electrical characteristics *1 db 16.5 14 10.9 high-gain mode f = frx gh power gain hg *1 db ?1.5 ?4.5 ?7.5 gl power gain lg *1 dbm ? 2 ?7 iip3h2 iip3 ?10 mhz offset hg reference values typ unit max note min conditions symbol parameter note) *1 : checked by design, not production tested. *2 : connector & substrate loss (0.1 db) included. application information reference values for design
an26032a 5 ver. ceb notes) vcc = 2.5 v to 3.0 v ta = ?25 cto85 c unless otherwise specified. *1 v ? 2.85 1.50 ? viht switching voltage (high gain mode) *1 v 0.4 0.0 ? ? vilt switching voltage (low gain mode) *1 a 10 4 ? current at cnt pin vih = vcc iiht switching current (high) vcc current at low-gain mode no input signal dc electrical characteristics *1 ma 5.9 4.0 ? vcc current at high-gain mode no input signal iccht supply current hg *1 a 10 1.0 ? iccht supply current lg reference values typ unit max note min conditions symbol parameter application information (continued) reference values for design (continued) note) *1 : checked by design, not production tested.
an26032a 6 ver. ceb *1 dbm ? ?10 ?16 high-gain mode f = frx p1dbht input p1db hg *1 db ?23 ?31 ? high-gain mode f1 = 620 mhz f2 = 1520 mhz gain(f2) ? gain(f1) attht1 attenuation1 hg *1 db ?40 ?49 ? high-gain mode f1 = 620 mhz f2 = 1880 mhz gain(f2) ? gain(f1) attht2 attenuation2 hg high-gain mode f1 = frx ? 10 mhz f2 = frx ? 20 mhz input 2 signals (f1, f2) low-gain mode f = frx low-gain mode f = frx, prx = ?20 dbm *1 ,*2 db 2.4 1.3 ? high-gain mode f = frx nfht noise figure hg *1,*2 db 8.0 4.5 ? nflt noise figure lg *1 dbm ? 4 ?6 high-gain mode f1 = frx + 10 mhz f2 = frx + 20 mhz input 2 signals (f1, f2) iip3h1ta iip3 +10 mhz offset hg ac electrical characteristics *1 db 17 14 10.4 high-gain mode f = frx ght power gain hg *1 db ?1.5 ?4.5 ?8 glt power gain lg *1 dbm ? 2 ?8 iip3h2ta iip3 ?10 mhz offset hg reference values typ unit max note min conditions symbol parameter notes) vcc = 2.5 v to 3.0 v ta = ?25 cto85 c, frx = 470 mhz, 620 mhz, 770 mhz, prx = ?30 dbm, cw unless otherwise specified. application information (continued) reference values for design (continued) note) *1 : checked by design, not production tested. *2 : connector & substrate loss (0.1 db) included.
an26032a 7 ver. ceb pin functions v cc power supply vcc b2 rf output output out2 b3 high-gain / low-gain switch l: low-gain mode h: high-gain mode input cnt b1 gnd ground gnd a2 rf input input in a1 rf output output out1 a3 description type pin name pin no. pin configuration top view functional block diagram vcc matching circuit out1 in gnd a3 b1 b3 a2 a1 out1 gnd in out2 vcc cnt b2 notes) this circuit and these circuit constants show an example and do not guarantee the design as a mass-production set. this block diagram is for explaining func tions. the part of the block diagram may be omitted, or it may be simplified. out2 cnt (gain cnt) a3 a2 a1 b1 b3 b2 top view
an26032a 8 ver. ceb package information ( reference data ) bump : snagcu reroute material : cu body material : br/sb free epoxy resin unit:mm package code:a lga006-w-0609aqa
an26032a 9 ver. ceb important notice 1.the products and product specificat ions described in this book are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to ma ke sure that the latest specifications satisfy your requirements. 2.when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 3.when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descr iptions and the usage notes in the book. 4.the technical information described in this book is inten ded only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any ot her company which may arise as a result of the use of technical information de-scribed in this book. 5.this book may be not reprinted or r eproduced whether wholly or partially, without the prior written permission of our company. 6.this lsi is intended to be used for general electronic equipment [cellular phones]. consult our sales staff in advance for information on the following applications: special applications in which exceptional quality and reliability are required, or if the failu re or malfunction of this lsi may directly jeopardize life or harm the human body. any applications other than t he standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliabili ty equivalent to (1) to (7) is required it is to be understood that our company sh all not be held responsible for any damage incurred as a result of or in connection with your using the lsi described in this book for any special application, unless our company agrees to your using the lsi in this book for any special application. 7.this lsi is neither designed nor intended for use in aut omotive applications or envir onments unless the specific product is designated by our company as comp liant with the iso/ts 16949 requirements. our company shall not be held responsible for any damage incu rred by you or any third party as a result of or in connection with your using the lsi in automotive application, unle ss our company agrees to your using the lsi in this book for such application. 8.if any of the products or technical in formation described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially , those with regard to security export control, must be observed. 9. please use this product in compliance with all applicable laws and regulations that regul ate the inclusion or use of controlled substances, including without limitation, the eu rohs directive. our company shall not be held responsible for any damage incurred as a result of your using the lsi not complying with the applicable laws and regulations.
an26032a 10 ver. ceb usage notes 1. when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc. ). especially, please be careful not to exceed the range of absolute maximum rati ng on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed val ues, take into the consideration of incidence of break down and failure mode, possible to occur to semi conductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are reco mmended in order to prevent physical injury, fire, social damages, for example, by using the products. 2. comply with the instructions for use in order to pr event breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mo unting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 3. pay attention to the direction of lsi. when mounting it in the wrong di rection onto the pcb (printed-circuit- board), it might smoke or ignite. 4. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the pin description for the pin configuration. 5. perform a visual inspection on the pcb before applying power, otherwise damage might happen due to problems such as a solder-bridge between the pins of t he semiconductor device. also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the lsi during transportation. 6. take notice in the use of this pr oduct that it might break or occasionally smoke when an abnormal state occurs such as output pin-vcc short (power supply fault), out put pin-gnd short (ground faul t), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended becaus e the extent of the above- mentioned damage and smoke emission will depend on the current capability of the power supply. 7. due to unshielded structure of this lsi, under exposure of light, function and characte ristic of the product cannot be guaranteed. during normal operation or even under test ing condition, please ensur e that lsi is not exposed to light. 8. basically, chip surface is ground potential. please design to ensure no contact between chip surface and metal shielding.
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

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